Rigetti has developed a highly coherent and scalable quantum integrated circuit architecture. Two key ingredients are a new fab process for superconducting through-silicon vias, and a low-temperature bonding process for 3D integration.

As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements. They have demonstrated that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.

They have make a strategic investment to build the world's first commercial quantum integrated circuit fab, called Fab-1.