Until now, two major challenges stood in the way of creating the terahertz microchip: overheating and scalability.

However, in a paper published this week in Laser and Photonics Review, Dr. Levy, head of HU's Nano-Opto Group and HU emeritus professor Joseph Shappir have shown proof of concept for an optic technology that integrates the speed of optic (light) communications with the reliability—and manufacturing scalability—of electronics.

Optic communications encompass all technologies that use light and transmit through fiber optic cables, such as the internet, email, text messages, phone calls, the cloud and data centers, among others. Optic communications are super fast but in microchips they become unreliable and difficult to replicate in large quantities.

Now, by using a Metal-Oxide-Nitride-Oxide-Silicon (MONOS) structure, Levy and his team have come up with a new integrated circuit that uses flash memory technology—the kind used in flash drives and discs-on-key—in microchips. If successful, this technology will enable standard 8-16 gigahertz computers to run 100 times faster and will bring all optic devices closer to the holy grail of communications: the terahertz chip.