Breaking News
Interview 1993 – Iain Davis Exposes the Technocratic Dark State
Get Ready! Something Big is Coming and They're Putting all The Pieces in Place | Redacted News
Here we go! This is about to get very UGLY
We Americans Need to Dig Deep into Historical Perspective
Top Tech News
This tiny dev board is packed with features for ambitious makers
Scientists Discover Gel to Regrow Tooth Enamel
Vitamin C and Dandelion Root Killing Cancer Cells -- as Former CDC Director Calls for COVID-19...
Galactic Brain: US firm plans space-based data centers, power grid to challenge China
A microbial cleanup for glyphosate just earned a patent. Here's why that matters
Japan Breaks Internet Speed Record with 5 Million Times Faster Data Transfer
Advanced Propulsion Resources Part 1 of 2
PulsarFusion a forward-thinking UK aerospace company, is pushing the boundaries of space travel...
Dinky little laser box throws big-screen entertainment from inches away
'World's first' sodium-ion flashlight shines bright even at -40 ºF
TSMC will starting full EUV lithography of 5 nanometer chips April 2019
The foundry's update showed that area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their historic rate. To compensate, TSMC gave an update on a half-dozen packaging techniques that it is developing to speed connections between chips.
The TSMC N7+ node that can use EUV on up to four layers. Its N5 that will use EUV on up to 14 layers will be ready for risk production in April. EUV aims to lower costs by reducing the number of masks required for leading-edge designs.
Samsung is ramping a 7-nm node using EUV. Intel is not expected to use EUV anytime soon. Globalfoundries announced in August that it has halted work on 7 nm and EUV.