Breaking News
Active Shooter in Tactical Gear Storms Border Patrol Station in Texas--Cops Neutralize Attacker
Benjamin Franklin and the Self-Made Man: Making America
SHOCK REPORT: DOJ, FBI Review Finds NO Jeffrey Epstein 'Client List,' Confirms Suicide - SF6
FBI Concludes Jeffrey Epstein Had No Clients, Didn't Blackmail Anyone, And Definitely Killed Him
Top Tech News
Insulator Becomes Conducting Semiconductor And Could Make Superelastic Silicone Solar Panels
Slate Truck's Under $20,000 Price Tag Just Became A Political Casualty
Wisdom Teeth Contain Unique Stem Cell That Can Form Cartilage, Neurons, and Heart Tissue
Hay fever breakthrough: 'Molecular shield' blocks allergy trigger at the site
AI Getting Better at Medical Diagnosis
Tesla Starting Integration of XAI Grok With Cars in Week or So
Bifacial Solar Panels: Everything You NEED to Know Before You Buy
INVASION of the TOXIC FOOD DYES:
Let's Test a Mr Robot Attack on the New Thunderbird for Mobile
Facial Recognition - Another Expanding Wolf in Sheep's Clothing Technology
Photonic signaling for multi-chip modules
PIPES aims
1. to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs
2. create advanced optical packaging and
3. switching technologies to address the data movement demands of highly parallel systems.
The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors.
The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact.