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Photonic signaling for multi-chip modules
PIPES aims
1. to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs
2. create advanced optical packaging and
3. switching technologies to address the data movement demands of highly parallel systems.
The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors.
The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact.