Breaking News
Traveler, 27, tests ALL major domestic airlines and private jet carriers in the US to create...
Children's gender clinic whistleblower tells Dr Phil patients were begging...
Moment Rep. Mike Waltz holds up a $90,000 bag of insulator joints as stumped USAF Secretary...
Israel strikes back at Iran: Explosions rock airbase in city linked to Tehran's nuke program...
Top Tech News
Blazing bits transmitted 4.5 million times faster than broadband
Rewiring
Scientists Close To Controlling All Genetic Material On Earth
Doodle to reality: World's 1st nuclear fusion-powered electric propulsion drive
Phase-change concrete melts snow and ice without salt or shovels
You Won't Want To Miss THIS During The Total Solar Eclipse (3D Eclipse Timeline And Viewing Tips
China Room Temperature Superconductor Researcher Had Experiments to Refute Critics
5 video games we wanna smell, now that it's kinda possible with GameScent
Unpowered cargo gliders on tow ropes promise 65% cheaper air freight
Wyoming A Finalist For Factory To Build Portable Micro-Nuclear Plants
TSMC 7+ Nanometer Chips Are in High Volume Production With 5, 6 nm in 2020
The N7+ process with EUV technology is built on TSMC's successful 7nm node and paves the way for 6nm and more advanced technologies.
The leading edge is currently at 7+ with about three layers done using EUV. In 2020, TSMC will ramp 5nm in the second half with significantly increased EUV usage of about 15 layers, followed by 6nm ramping at the end of 2020 with about four layers done in EUV, according to Jim Fontanelli, a senior analyst with Arete Research.
N7+ is also providing improved overall performance. When compared to the N7 process, N7+ provides 15% to 20% more density and improved power consumption, making it an increasingly popular choice for the industry's next-wave products. TSMC has been quickly deploying capacity to meet N7+ demand that is being driven by multiple customers.